ENGINEERED INTERCONNECT DIELECTRIC CAPS HAVING COMPRESSIVE STRESS AND INTERCONNECT STRUCTURES CONTAINING SAME

摘要

PURPOSE: An interconnect dielectric material cap formed to have compressive stress, and interconnect structures having the same are provided to reduce the crack of layers and devices and improve the reliability of the device. CONSTITUTION: The structure comprises a dielectric material(14), a barrier layer(16), and at least one conductive component(18). The typical compressive stress of a dielectric capping layer(20) is between 200MPa and 2000MPa. The compressive stress of the deposited dielectric capping layer is continuously maintained even after the baking step operated after the evaporation.