| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component wherein a semiconductor element is sealed by a package, and whisker is suppressed as caused from the surface of the leads of the package from which many leads are projected. SOLUTION: The semiconductor element of the electronic component is sealed in the package such as a flat package, an outline package, and an inline package; and the many leads 3 are projected from the package. All or part of edges 3c on the surface of the leads is formed to be curved. COPYRIGHT: (C)2007,JPO&INPIT
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