| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is provided with a semiconductor construct called a CSP on a base plate, wherein interconnects for power supply signal and ground signal of the semiconductor construct are not burnt to be cut even when excessive current flows to the interconnects.SOLUTION: The interconnect for power supply signal indicated by number 10a is arranged all over a region in a plane square shape, including four connection pads 5a for power supply signal, on a left upper side of a silicon substrate 4, and connected to all the four connection pads 5a for power supply signal. The interconnect for ground signal indicated by number 10b is the same. Consequently, even if overcurrents flow to the interconnects 10a and 10b, the interconnects 10a and 10b are not burnt to be cut. |
