发明名称 LIQUID COMPOSITION AND MOUNTING MATERIAL FOR ELECTRONIC USE
摘要 PROBLEM TO BE SOLVED: To provide a liquid composition having excellent physical properties such as heat-resistance and exhibiting liquid state at room temperature even essentially in the absence of a volatile component such as an organic solvent, and to provide a mounting material for electronic use produced by using the composition.SOLUTION: The liquid composition includes a compound having a reactive group, a crosslinking agent and a silane compound having a specific structure, wherein the compound containing the reactive group is solidified at room temperature and has a melting point of ≤200°C.
申请公布号 JP2011012153(A) 申请公布日期 2011.01.20
申请号 JP20090156837 申请日期 2009.07.01
申请人 NIPPON SHOKUBAI CO LTD 发明人 SUGIOKA TAKAHISA;FUJIBAYASHI TERUHISA
分类号 C08L83/08;C08G77/26;C08K5/1539;C08K5/17 主分类号 C08L83/08
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