| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a novel selective electroless plated metal layer for enabling the selective electroless plated metal layer to be formed into a purposed circuit pattern shape on the surface of a non conductive base member without using a plated mask layer in the form where the surface of a bonding agent layer and the manufactured plated metal layer make direct contact with each other.SOLUTION: A bonding agent layer using a curable binder resin is provided on a surface of a non-conductive base member, on the surface of which metal microparticles or fine powdered organic metal compounds both having an average particle diameter of 1 to 200 nm are exposed densely with high surface density. Further, by irradiating a region corresponding to a circuit pattern shape with an energy ray to apply electroless plating thereto, the electroless plated metal layer can be selectively formed only in the energy ray irradiation region. This enables the electroless plated metal layer to be fixedly mounted on the surface of the non conductive base member with high bonding property via the bonding agent layer. |
