| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection system that improves efficiency of test by minimizing passing of data between an inspection apparatus body and an external device.SOLUTION: The semiconductor inspection system is configured to manage wafers in lots of n, which is a predetermined number, and measure each of the wafers by multiple shots while carrying out data communications between the inspection apparatus body and the external device, the wafer being divided into multiple regions and having chips to be measured thereon, wherein the inspection apparatus body includes an information storage unit for storing XY coordinate information and on-wafer information in each shot, the information being transmitted from the external device for each lot. |
