| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a rear surface irradiation type solid-state image pickup device for reducing manufacturing steps to improve productivity.SOLUTION: The method for manufacturing the rear surface irradiation type solid-state image pickup device includes at least, forming a plurality of matrix-shaped light receiving parts within a substrate, forming a first insulating film on a first surface of the substrate, forming a through-via penetrating through the first insulating film and engraved on the substrate, forming a laminated interconnection layer on the first insulating film, grinding the opposite side of the first surface of the substrate, forming a second insulating film on the second surface being the opposite side of the first surface of the substrate, and forming a color filter and an on-chip lens on the second insulating film. The step of polishing is continued until the through-via is exposed. |
