LOW-PERMITTIVITY RESIN COMPOSITION

摘要

Provided is (1) a low-permittivity resin composition, having a sufficiently low permittivity and dielectric loss tangent, wherein hollow silica particles are dispersed in a matrix resin, said hollow silica particles having a mean diameter between 0.05 µm and 3 µm and a BET specific surface area of less than 30 m2/g. Also provided is (2) a low-permittivity film comprising said low-permittivity resin composition. Further provided is (3) a method for manufacturing the low-permittivity resin composition and low-permittivity film, said method including a step which: prepares either hollow silica particles (A) that contain air inside or core-shell silica particles (B) that enclose a material that is eliminated upon firing, thereby forming hollow regions; fires same at a temperature exceeding 950°C, thereby preparing hollow silica particles (C); and prepares a liquid dispersion wherein the hollow silica particles are dispersed in a matrix resin forming material. Additionally provided is a coating agent (4) for a low-permittivity film, wherein the aforementioned hollow silica particles are dispersed in a matrix resin forming material.