摘要 |
<p>The lacquer film product (1) for applying a seamless surface over an object (3) embedded in a carrier element (2), comprises a transparent area (4), which is arrangeable over the object, a transparent film layer (5), and a transparent cover layer in-situ produced using a hardenable material by supplied energy, where the cover layer is arranged on one side of the film layer turned away from the carrier element. The film layer has one of a screen printed layer and a base coat layer at one side of the film layer onto an area that does not contain the transparent area. The lacquer film product (1) for applying a seamless surface over an object (3) embedded in a carrier element (2), comprises a transparent area (4), which is arrangeable over the object, a transparent film layer (5), and a transparent cover layer in-situ produced using a hardenable material by supplied energy, where the cover layer is arranged on one side of the film layer turned away from the carrier element. The film layer has one of a screen printed layer and a base coat layer at one side of the film layer onto an area that does not contain the transparent area. The hardened transparent cover layer is made of hardenable material by photonic or electronic radiation energy. The hardenable material comprises a first ethylene group containing polymer with a mole mass of more than 2000 g/mole, a second ethylene group containing polymer with a mole mass of less than 2000 g/mole, and a third ethylene group containing polymer that is a thermoplastic polymer. The hardenable material absorbs the photonic radiation with a wavelength range of 250-400 nm. The hardenable material absorbs the electronic radiation in an energy range of 150-300 keV, provides the cover layer, and has a removable protective layer at the side turned away from the film layer. A side of the film layer and/or the screen printed layer turned to the carrier element and the object has an adhesive layer. The film layer is a composite film made of two or more films. Independent claims are included for: (1) a carrier element; and (2) a method for providing a carrier element.</p> |