发明名称 |
STRESS SENSOR, AND ASSEMBLING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturizable stress sensor reducing cost.SOLUTION: This stress sensor includes a circuit board, a direction control component and a bottom part metal plate. The circuit board includes a stress sensing means constituted of a stress deformation section and a plurality of stress sensing resistances provided on the stress deformation section. The direction control component is installed on the upper surface of the circuit board, and connected to the stress sensing means. The bottom part metal plate includes a section for adhesive application adhering to a plurality of fixing sides of the circuit board. The stress sensor has advantages such as a small number of components, a small size and reduced cost. |
申请公布号 |
JP2011013202(A) |
申请公布日期 |
2011.01.20 |
申请号 |
JP20090175140 |
申请日期 |
2009.07.28 |
申请人 |
ELAN MICROELECTRONICS CORP |
发明人 |
RIN SHUNKA;KARASAWA FUMIAKI;KO SHUNKETSU;KO SHIRO |
分类号 |
G01L5/16;G06F3/033 |
主分类号 |
G01L5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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