发明名称 VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To solve such a problem that a high-temperature region and a low-temperature region are formed on a shower plate due to an influence of a heating region of a substrate-heating heater, a flaky product that easily exfoliates is formed on the surface of the shower plate at the low-temperature region (non-heated region) in an outer peripheral portion of the shower plate, and the product deposits on a substrate to be treated as a contaminant and causes the deterioration of the quality and uniformity of the film.SOLUTION: This vapor deposition apparatus is constituted by: arranging a space in the outside of a region of the shower plate opposing to a substrate-holding member and in the contacting face between a shower head and the shower plate; and providing a plurality of through-holes that communicate with the inside of a reaction chamber, in a region part in which the space of the shower plate has been arranged, and that introduce a purge gas to the reaction chamber therethrough. Therefore, the apparatus can pass a source gas which exists on the surface of the shower plate in the non-heated region, toward a gas exhaust port side, and further can make a stagnant region hardly formed at a corner. Thus, the apparatus reduces the product to be formed on the surface of the shower plate, and secures the uniformity and reproducibility of the film on the substrate to be treated.
申请公布号 JP2011012331(A) 申请公布日期 2011.01.20
申请号 JP20090159720 申请日期 2009.07.06
申请人 SHARP CORP 发明人 OKADA TOSHINORI;UNEYAMA KAZUHIRO;SAKAGAMI HIDEKAZU;TSUBOI TOSHIKI
分类号 C23C16/455;H01L21/205 主分类号 C23C16/455
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