发明名称 SEMICONDUCTOR INTEGRATED DEVICE
摘要 In one embodiment, a semiconductor integrated device includes a plurality of semiconductor chips each having a first internal circuit and a second internal circuit and being stacked while displaced from each other. The first internal circuit processes a data signal in accordance with a predetermined process. The second internal circuit receives a request signal from a transmission source and determines whether the request signal is a request to itself or not. When the request signal is the request to the second internal circuit itself, the second internal circuit receives a data signal from a transmission source and outputs the data signal to the first internal circuit. When the request signal is not the request to the second internal circuit itself, the second internal circuit transfers the request signal to a transfer destination, receives the data signal from the transmission source and transfers the data signal to the transfer destination.
申请公布号 US2011012761(A1) 申请公布日期 2011.01.20
申请号 US20100832367 申请日期 2010.07.08
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MORIMITSU HIROYUKI
分类号 H03M9/00;H03L7/00 主分类号 H03M9/00
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