PHOTOSENSITIVE POLYIMIDE AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME

摘要

The present invention relates to a polyimide or to a precursor thereof, as expressed in chemical formula 1 or 2, and to a photosensitive resin composition comprising same. The polyimide or the precursor thereof is produced from a diamine containing a polyalkylene oxide. The photosensitive resin composition of the present invention not only has excellent optical transmittance, resolution, photosensitivity and image-forming capability, but also exhibits superior adhesion properties to a substrate of silicon film, silicon oxide film or metal film. Particularly, the photosensitive resin composition of the present invention can be produced into a high-quality film with no defects such as cracks or the like.