发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor device wherein a semiconductor element made of Si or Si group material mounted on a substrate, the semiconductor element is mounted on the substrate and the semiconductor element is bonded to a silver bonding material via a oxide film formed on the semiconductor element. The bonding material comprising silver oxide particles having an average particle size of 1 nm to 50 nm and an organic reducing agent is used for bonding in air, which gives a high bonding strength to the oxide on the semiconductor element.
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申请公布号 |
US2011012262(A1) |
申请公布日期 |
2011.01.20 |
申请号 |
US20100825783 |
申请日期 |
2010.06.29 |
申请人 |
MORITA TOSHIAKI;YASUDA YUSUKE;IDE EIICHI |
发明人 |
MORITA TOSHIAKI;YASUDA YUSUKE;IDE EIICHI |
分类号 |
H01L23/498;H01L21/768 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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