| 摘要 |
A semiconductor device includes a wiring substrate, a first semiconductor chip mounted on the wiring substrate, a second semiconductor chip mounted to the wiring substrate in a lateral direction thereof, a first radiation unit connected to the first semiconductor chip, and arranged to extend from an upper side of the first semiconductor chip to an upper side the second semiconductor chip, and a second radiation unit connected to the second semiconductor chip, and arranged to extend from an lower side of the first radiation unit to an outside thereof in a non-contact state to the first radiation unit.
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