发明名称 OPTICAL MODULE AND MANUFACTURING METHOD THEREOF
摘要 <p>The present invention relates to an optical module and a manufacturing method thereof and comprises of: a substrate on which an optical device chip is formed; a spacer in which at least one through-hole is formed which is coupled to an upper part of the substrate to be able to insert the optical device chip into the through-hole; a cover coupled to an upper part of the spacer to close the through-hole; and an optical fiber coupled to an upper part of the cover corresponding to a location of the optical device chip. The present invention is configured to apply the light received through the optical fiber to the optical device chip or apply the light emitted from the optical device chip to the optical fiber and thereby the optical module can be miniaturized and the manufacturing cost of the optical module can be reduced under mass production.</p>
申请公布号 WO2011007909(A1) 申请公布日期 2011.01.20
申请号 WO2009KR03935 申请日期 2009.07.21
申请人 XL PHOTONICS INC.;CHOO, HEUNG RO 发明人 CHOO, HEUNG RO
分类号 G02B6/42 主分类号 G02B6/42
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