WIRING MEMBER FOR SEMIDONDUCTOR APPARATUS, COMPOSITE WIRING MEMBER FOR SEMICONDUCTOR APPARATUS, AND RESIN SEALED SEMICONDUCTOR APPARATUS

摘要

PURPOSE: A semiconductor device wiring member, a complex wiring member for semiconductor device, and a resin sealed semiconductor device is provided to have a strength advantage, while offering easy maintenance and thin thickness. CONSTITUTION: An insulating layer(11) is made of polyimide. A metallic board(12) is arranged on one side of the insulating layer. A copper wiring layer(13) is arranged on the other side of the insulating layer. A second connection unit(19) is made of the golden bonding wire.