| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus that improves adhesion of a film.SOLUTION: The electronic apparatus for improving the adhesion of the film has: a housing 22 having a first surface 35, and a second surface 36 located at a different height in the direction perpendicular to the first surface 35 and arranged with a through-hole 361; and a film 31 arranged with a first region facing the first surface of the housing 22, and a second region (A) having a wall thickness larger than that of the first region and facing the second surface 36 of the housing 22. |
