METHOD OF MANUFACTURING INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION ELEMENT CHIP, AND INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION ELEMENT CHIP; METHOD OF MANUFACTURING INTEGRATED THERMOELECTRIC CONVERSION ELEMENT MODULE, AND INTEGRATED THERMOELECTRIC CONVERSION MODULE; AND METHOD OF MANUFACTURING INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION PANEL, AND INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION PANEL

摘要

PROBLEM TO BE SOLVED: To prevent the function of an entire chip from failing even when a break occurs in some elements in the chip, and to provide a method of manufacturing integrated and coupled thermoelectric conversion element chips more easily.SOLUTION: The method of manufacturing integrated and coupled thermoelectric conversion element chips includes: a step of forming a first electric insulating material having excellent heat conduction and then forming a pair of a first conductive member and a second conductive member, which have different Seebeck coefficients, on the first electric insulating material; a step of forming a first conductive coupling member and a second conductive coupling member on the first and second conductive members by using a thin-film process; a step of forming a third conductive member and a fourth conductive member on the first and second conductive coupling members so as to form multiple coupled thermoelectric conversion elements; and a final step of joining the multiple coupled thermoelectric conversion elements to each other through a joining conductive member so as to form multiple integrated and coupled thermoelectric conversion element chips. The output ends of the multiple integrated and coupled thermoelectric conversion element chips are connected in series and/or in parallel so as to form multiple modules. The modules are connected so as to obtain a panel/sheet of integrated and coupled thermoelectric conversion elements.