| 摘要 |
PROBLEM TO BE SOLVED: To efficiently manufacture a substrate for a semiconductor substrate with high reliability by suppressing the warpage of, for example, a glass substrate.SOLUTION: A method of manufacturing the substrate for the semiconductor device includes a sticking process of arranging and sticking a first element substrate (200a) and a second element substrate (200b) via adhesives (500) interposed therebetween so that a surface of a first substrate (20a) where a first semiconductor element (30a) is formed and a surface of a second substrate (20b) where a second semiconductor element (30b) is formed are opposed to each other, and a plate thinning process of performing plate thinning processing on a surface of the first substrate where the first semiconductor element is not formed and a surface of the second substrate where the second semiconductor element is not formed after the sticking process. Furthermore, the method of manufacturing the substrate for the semiconductor device includes a support substrate sticking process of sticking support substrates (11) on the first and second substrates, respectively, and a separating process of separating the first and second element substrates from each other by peeling the adhesives from the first and second substrates. |
