| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamideimide resin, a polyamideimide resin composition, and a coating, which can be cured at a low temperature, whose elastic modulus is made low, and whose adhesion to a substrate is hardly reduced by a large deformation of the substrate, so that these are used as a coating for a very flexible substrate such as a rubber.SOLUTION: The polyamideimide resin is obtained by reacting a mixture containing (a) a tricarboxylic acid derivative having an acid anhydride group, (b) a dicarboxylic acid represented by formula (I) wherein a+b+c is a real number of 1 to 80; Ris hydrogen or a methyl group; Ris a cyano group, a carboxyl group or the like, and (c) an aromatic polyisocyanate, wherein the component (a) and the component (b) are contained in such a blend proportion that the ratio (a)/(b) of the total number of the carboxyl group and the acid anhydride group in the component (a) and the total number of the carboxyl group in the component (b) is 0.45/0.55 to 0.80/0.20. |
