| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which sufficiently secures the width of an element connection pad for connection with an electrode terminal of a semiconductor element through soldering, and can firmly connects the electrode terminal of the semiconductor element and the element connection pad through soldering.SOLUTION: In a wiring board 10, a plurality of beltlike wiring conductors 2 for semiconductor element connection is formed in juxtaposition on an insulating substrate 1, and at the same time, an element connection pad 3 with which the electrode terminal of a semiconductor element S is flip-chip connected is formed in a part of the beltlike wiring conductor 2, and on the insulating substrate 1 and on the beltlike wiring conductor 2, a solder resist layer 5 having an opening 4 which exposes the element connection pad 3 is deposited, the beltlike wiring conductor 2 is a smooth surface in which the surface on which the solder resist layer 5 is deposited is roughened and the exposed surface of the element connection pad 3 bulges more outside than the roughened surface. |
