BONDING MATERIAL AND BONDING METHOD EACH USING METAL NANOPARTICLES

摘要

In conventional bonding materials and bonding methods using nanoparticles, it has been proposed to use microparticles in combination with the nanoparticles. The conventional bonding materials and bonding methods, however, have a problem such that it is not easy to mix the nanoparticles and the microparticles uniformly. In the present invention, a bonding material that is composed of metal nanoparticles, which have an average particle diameter of not more than 100 nm and are coated with an organic substance having 6-8 carbon atoms, and a polar solvent in an amount of 5-20% by mass relative to the powder composed of the metal nanoparticles is used. Object to be bonded are fired at a temperature of 200-350°C under pressure with the bonding material interposed therebetween. Consequently, the metal nanoparticles are melted and returned to a bulk material, so that a bonding layer of the bulk material can be formed at a low temperature that is lower than or equal to the melting point.