发明名称 BENDABLE LUMINOUS MODULES AND METHOD FOR PRODUCING BENDABLE LUMINOUS MODULES
摘要 A luminous module (1) has a carrier (8, 10) for fastening at least one semiconductor light source (5), wherein the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is areally connected to at least one base plate (8), and the carrier (8, 10) can be bent along at least one predetermined bending line (3), and wherein the base plate (8) can also be bent at the at least one bending line (3), the base plate (8) has at least one cutaway section (9) at the bending line (3), and the flexible printed circuit board (10) has at least one web (11) which crosses one of the at least one cutaway sections (9). A method is used to produce a luminous module (1), wherein the method involves: areally laminating the flexible printed circuit board (10) onto the base plate (8) which is, in particular, planar.
申请公布号 WO2011006725(A1) 申请公布日期 2011.01.20
申请号 WO2010EP58475 申请日期 2010.06.16
申请人 OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG;PREUSCHL, THOMAS 发明人 PREUSCHL, THOMAS
分类号 H05K1/00;F21S8/00;F21S8/08;F21W131/103;F21Y101/02;H05K1/18;H05K3/00 主分类号 H05K1/00
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