| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus capable of efficiently removing plating precipitated on a cathode.SOLUTION: In the plating treatment in which a material 2 to be plated is immersed into an electrolytic plating liquid 3, positive and negative potentials are impressed to each of an anode 12 arranged to be opposed to the material 2 to be plated and a cathode 13 arranged to be driven between a position in electrical contact with the material 2 to be plated and a position in electrical non-contact with the material 2 to be plated. When the cathode is in electrical contact with the material 2 to be plated, the negative potential is impressed to the cathode and the positive potential is impressed to a peeling electrode 16 arranged to be opposed to the cathode. When the cathode is in electrical non-contact with the material 2 to be plated, the positive potential is impressed to the cathode and the negative potential is impressed to the peeling electrode. |
