发明名称 |
METAL LAMINATE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a metal laminate structure which is reduced in thickness and efficiently manufactured.SOLUTION: The metal laminate structure includes a first metal layer, a second metal layer and a third metal layer. The first metal layer is installed on one surface of the second metal layer and the third metal layer is installed on other surface of the second metal layer. The first metal layer contains tungsten, the second metal layer contains copper, and the third metal layer contains tungsten. |
申请公布号 |
JP2011014917(A) |
申请公布日期 |
2011.01.20 |
申请号 |
JP20100185166 |
申请日期 |
2010.08.20 |
申请人 |
SUMITOMO ELECTRIC IND LTD;ALLIED MATERIAL CORP |
发明人 |
NITTA KOJI;MASHIMA MASATOSHI;INASAWA SHINJI;ABE YUGAKU;YOKOYAMA HIROSHI;SUWATA OSAMU;YAMAGATA SHINICHI |
分类号 |
H01L23/373;C25D5/10;C25D7/00;C25D7/06;H01L23/36;H05K7/20 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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