| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor apparatus by which peeling of an insulating layer laminated on an upper surface of a semiconductor substrate is suppressed, and to provide a method of manufacturing the same.SOLUTION: The semiconductor apparatus 10 has the semiconductor substrate 12 having an element formation region 14 around which a scribe region 34 is arranged, at least one wiring layer formed on the semiconductor substrate 12 via the insulating layer, a seal ring 36 formed so as to surround the element formation region 14, a rewiring 48 connected with a pad consisting of the top-layer wiring layer, and a second resin layer 32 covering the rewiring 48. In addition, in the scribe region 34, a removal region 38 is provided by removing an oxide film 16 covering the upper surface of the semiconductor substrate 12 and each insulating layer. |
