发明名称 |
RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a resist composition which is excellent in adhesion of a resist film to a substrate or the like, and suppresses pattern collapse, and also to provide a resist pattern forming method.SOLUTION: The resist composition contains: a base component (A) the solubility of which in an alkali developer changes by the action of an acid; an acid generator component (B) which generates an acid upon exposure; and an epoxy resin (G). The resist pattern forming method includes the steps of: forming a resist film on a support by using the resist composition; exposing it; and alkali developing it to form a resist pattern. |
申请公布号 |
JP2011013502(A) |
申请公布日期 |
2011.01.20 |
申请号 |
JP20090158145 |
申请日期 |
2009.07.02 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
HIRANO ISAO;NAMITO TOSHIAKI |
分类号 |
G03F7/039;C08F20/10;C08G59/20;G03F7/004;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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