| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in cryogenic cooling using a refrigerator wherein it is required to sufficiently secure thermal conductivity between a chip and a cooling head to effectively cool the chip and increase in tightening torque of a screw to improve contact causes damage and deformation, and thus, improve thermal contact between a chip and a cooling head without damaging the chip for mounting.SOLUTION: In a cryogenic cooling device, when the chip is mounted to the cooling head of a refrigerator, a substrate for processing and a power transmission component with a square frame shape etc. are provided and while a chip carrier substrate mounted with the chip, a printed wiring substrate, the power transmission component and the substrate for processing are superposed on each other, the substrate for processing is fixed to the refrigerator by screws etc. By tightening the screws etc., the substrate for processing presses the power transmission component, the power transmission component presses the printed wiring substrate, and the printed wiring substrate presses the chip carrier substrate. Thus, thermal contact performance is improved between the chip carrier substrate and the cooling head. |
