CONNECTION METHOD AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a connection method which improves a particle trap efficiency between electrodes to achieve a superior conduction state and a connection structure which is obtained by employing the connection method.SOLUTION: By pressing a press head 25 on an upper surface of a peeling film 243 of a film laminate 24 to press the film laminate 24, a substrate 21 and anisotropic conductive film 241 are pressure bonded temporarily. In this case, by the press head 25, a position in a predetermined area which is other than an output electrode area 23 of the substrate 21 in the anisotropic conductive film 241 is pressed in deeply more than the position on the output electrode area 23 in the anisotropic conductive film 241.