| 摘要 |
PURPOSE: A hardened gold plating liquid, capable of suppressing a plated layer on besides a plating section, and a plating method using the same, is provided to install a Ni barrier layer on a small sized connector. CONSTITUTION: A hardened gold plating liquid comprises gold cyanide, cyanide salt, cobalt salt, nitro containing compound, and the compound more than 1 or 2 selected from the group composed of carboxyclic acid, oxy carboxyclic acid and their salts. The concentration of the nitro containing compound is 0.1~20g / L. The plating leakage can be prevented by controlling the electric current density by adjusting the thickness of a gold film of a Ni barrier part(14) less than 0.01μm.
|
