发明名称 SAMPLE HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a sample heating device capable of ensuring high heat insulation properties even without using any thick heat-insulating materials.SOLUTION: An air layer having small thermal conductivity is formed as a heat insulation layer between an oven for heating an analysis sample and the heat-insulating layers for surrounding the oven, thus ensuring heat insulation properties higher than before. The heat insulation layer made of air can obtain a sufficient heat insulation effect even if it is thin, thus thinning the heat-insulating material as compared with a conventional device and miniaturizing the device.
申请公布号 JP2011013151(A) 申请公布日期 2011.01.20
申请号 JP20090158976 申请日期 2009.07.03
申请人 SHIMADZU CORP 发明人 KITAMURA KENICHI;MIHASHI SHINICHI;UMAJI TAKESHI
分类号 G01N1/28;G01N1/22;G01N30/04;G01N30/12;G01N30/16 主分类号 G01N1/28
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