| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-halogen and non-antimony epoxy resin composition for a sealant with good warpage of package and gold wire deformation, and flame resistance without declines of reliability in characteristic features such as moldability, reflow-proof and moisture resistance that can be left unattended at high temperatures, and an electronic component device equipped with elements sealed with the composition. SOLUTION: The epoxy resin composition for a sealant contains (A) the epoxy resin, (B) a curing agent of compound (C) shown by a general formula (I) (wherein R<SP>1</SP>is selected from a hydrogen atom and a 1-10C optionally substituted univalent hydrocarbon group, R<SP>2</SP>is selected from a hydrogen atom and a 1-10C optionally substituted univalent hydrocarbon group, n represents 0 or an integer of 1-10 and m represents 0 or an integer of 1-10) and the compound shown by the general formula (I) is contained at rates of 50-90 mass% of the total amount of (B) the curing agent. COPYRIGHT: (C)2008,JPO&INPIT
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