| 摘要 |
PURPOSE: A semiconductor product BGA device automatic inspecting device is provided to reduce a failure rate. CONSTITUTION: A digital CCD camera takes a photograph of a target object. A frame grabber receives image data saved in the digital CCD camera. The frame grabber drives the CCD camera and takes charge of an interface. An illumination device offers illumination according to a checking object and items. A software part includes the frame grabber in order to obtain the FBGA image of a check program, a hardware interface module which sends an inspection setup module to a PLC, and a kernel module. |
