发明名称 METHOD FOR DEPOSITING WATER-REPELLENT MOLD RELEASE THIN FILM AND WATER-REPELLENT MOLD RELEASE LAMINATED FILM
摘要 PROBLEM TO BE SOLVED: To provide a water-repellent mold release laminated film which has a deposited film of an organosilicon compound with water repellency and usable for various applications, and to provide a method for producing the water-repellent mold release laminated film.SOLUTION: In the method for producing a water-repellent mold release laminated film obtained by depositing a carbon-containing organosilicon compound film on a plastic base material by a plasma-enhanced chemical vapor deposition process (PE-CVD process), an organosilicon compound containing an Si-O bond in the molecule is used as a vapor deposition raw material, and plasma-enhanced chemical vapor deposition is performed in a gas atmosphere containing no oxygen atoms upon the vapor deposition of the organosilicon compound gas (in a non-oxygen-state atmosphere) in a state where the plastic base material is cooled and held to Tg or below, and the vapor deposited film of a carbon-containing silicon compound with water repellency is deposited on the plastic base material.
申请公布号 JP2011012285(A) 申请公布日期 2011.01.20
申请号 JP20090154491 申请日期 2009.06.30
申请人 DAINIPPON PRINTING CO LTD 发明人 MATSUI SHIGEKI;OKANO AI;CHIBA DAIDO;MATSUMOTO YUJI
分类号 C23C16/42;B32B9/00;B32B27/00 主分类号 C23C16/42
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