发明名称 |
METHOD FOR DEPOSITING WATER-REPELLENT MOLD RELEASE THIN FILM AND WATER-REPELLENT MOLD RELEASE LAMINATED FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a water-repellent mold release laminated film which has a deposited film of an organosilicon compound with water repellency and usable for various applications, and to provide a method for producing the water-repellent mold release laminated film.SOLUTION: In the method for producing a water-repellent mold release laminated film obtained by depositing a carbon-containing organosilicon compound film on a plastic base material by a plasma-enhanced chemical vapor deposition process (PE-CVD process), an organosilicon compound containing an Si-O bond in the molecule is used as a vapor deposition raw material, and plasma-enhanced chemical vapor deposition is performed in a gas atmosphere containing no oxygen atoms upon the vapor deposition of the organosilicon compound gas (in a non-oxygen-state atmosphere) in a state where the plastic base material is cooled and held to Tg or below, and the vapor deposited film of a carbon-containing silicon compound with water repellency is deposited on the plastic base material. |
申请公布号 |
JP2011012285(A) |
申请公布日期 |
2011.01.20 |
申请号 |
JP20090154491 |
申请日期 |
2009.06.30 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
MATSUI SHIGEKI;OKANO AI;CHIBA DAIDO;MATSUMOTO YUJI |
分类号 |
C23C16/42;B32B9/00;B32B27/00 |
主分类号 |
C23C16/42 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|