| 摘要 |
PURPOSE: A wafer cleaning device is provided to easily remove a foreign material which is attached to a wafer by spraying high pressure water and cleaning it. CONSTITUTION: A drainpipe is formed in the lower side of a cleaning bath(12). An overflow pipe(14) is formed in the side of the cleaning bath. A ball bearing(23) is connected to a different side. An ultrasonic generator(40) is installed in both walls in the longitudinal direction of the cleaning bath.
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