| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a package that is improved in yield, and to provide a semiconductor device.SOLUTION: The method of manufacturing the package includes a first process of forming a metal pattern MP including a frame part FP and a plurality of lead parts LP extending inward from the frame part FP, a second process of molding a resin pattern RP including a first resin part 6 holding the plurality of lead parts LP from inside, and a second resin part 7i covering a lower surface of a peripheral part 2b of the lead part LP for a part 2a of the lead part LP to be removed while exposing a lower surface of the part 2a to be removed in the lead part LP so as to hold the plurality of lead parts LP from below, and a third process of cutting the plurality of lead parts LP into a plurality of first lead parts 8 and a plurality of second lead parts 9 by removing parts 2a of the lead parts LP to be removed while maintaining a state wherein peripheral parts 2b of the lead parts LP are held with the resin pattern RP. |
