| 摘要 |
PROBLEM TO BE SOLVED: To suppress an omission of a photosensitive resin layer and a resist layer formed of this photosensitive resin layer at a hole edge, and to maintain full continuity between a through-hole and a conductor wiring.SOLUTION: A method for manufacturing a printed wiring board with a through-hole includes a first photosensitive resin layer forming step of coating a negative-type photosensitive resin composition on a panel for manufacturing the printed wiring board 1, to form a first photosensitive resin layer 5a on an inner face of a through hole 4 and a surface of a conductor layer 3; and a second photosensitive resin layer forming step of further coating a negative-type photosensitive resin composition on a surface of the panel for manufacturing the printed wiring board 1, with the first photosensitive resin layer 5a formed thereon to form a second photosensitive resin layer 5b, whereby a photosensitive resin layer 5 constituted of the first photosensitive resin layer 5a and the second photosensitive resin layer 5b is formed, the surface of the panel for manufacturing the printed wiring board 1 is coated by the first photosensitive resin layer 5a; and the second photosensitive resin layer 5b and the inner face of the through hole 4 is coated by only the first photosensitive resin layer 5a. |
