POLYIMIDE FILM AND COPPER CLAD LAMINATE USING THE FILM AS BASE MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film which is excellent in size stability and suitable for a fine pitch circuit substrate, particularly a COF (Chip on Film) for wiring in a narrow pitch toward a film width; and a copper clad laminate using the film as a base material.SOLUTION: The polyimide film is characterized to have a thermal expansion coefficient αMD of 3-10 ppm/°C in the machine-transferring direction (MD) and a thermal expansion coefficient αTD of 10-20 ppm/°C in the width direction (TD). The copper clad laminate is characterized to use the polyimide film as a base material, on which the copper laminate is formed to have a thickness of 1-10 μm.