发明名称 |
PHOTOCURABLE RESIN COMPOSITION |
摘要 |
<p>Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.</p> |
申请公布号 |
WO2011007566(A1) |
申请公布日期 |
2011.01.20 |
申请号 |
WO2010JP04572 |
申请日期 |
2010.07.14 |
申请人 |
TAIYO HOLDINGS CO., LTD.;SHIBASAKI, YOKO;ARIMA, MASAO |
发明人 |
SHIBASAKI, YOKO;ARIMA, MASAO |
分类号 |
G03F7/031;C08F2/50;G03F7/004;H05K3/28 |
主分类号 |
G03F7/031 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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