发明名称 |
DEVICE AND METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR PRODUCING A PROCESSED SUBSTRATE |
摘要 |
<p>Disclosed are a device for processing a substrate and a method for processing a substrate employing said processing device, which are simple and make it possible to provide a processed substrate which has a smooth surface. Also provided is a method for producing a processed substrate employing said processing method. A device (10) for processing a substrate (1) has disposed thereon a member (12) for spraying abrasive grains (12a) in such a way that the angle of spraying of the abrasive grains (12a) with respect to the surface of the substrate (1) which is being processed is an angle employed in brittleness processing, and a spray direction changing member (18) for changing the angle of entry of the abrasive grains (12a) onto the processing surface of the substrate (1) from an angle employed in brittleness processing to an angle employed in ductility processing is disposed between the spraying member (12) and the processing surface of the substrate (1) in the direction of spraying of the abrasive grains (12a). The spray direction changing member (18) is moveable.</p> |
申请公布号 |
WO2011007476(A1) |
申请公布日期 |
2011.01.20 |
申请号 |
WO2010JP02197 |
申请日期 |
2010.03.26 |
申请人 |
SHARP KABUSHIKI KAISHA;YOSHIZAWA, TAKENORI;MIZUKAMI, YASUFUMI |
发明人 |
YOSHIZAWA, TAKENORI;MIZUKAMI, YASUFUMI |
分类号 |
B24C1/04;B24C5/02;B24C5/04 |
主分类号 |
B24C1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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