发明名称
摘要 Provided is Sb-Te alloy powder for sintering in which the maximum grain size of the powder obtained by subjecting gas atomized powder of an Sb-Te alloy to mechanical pulverization is 90µm or less, and a sintered compact sputtering target obtained by sintering this powder. Further provided is a manufacturing method of Sb-Te alloy powder for a sintered compact sputtering target including the steps of dissolving an Sb-Te alloy, thereafter subjecting this to gas atomization to obtain atomized powder, and further subjecting this to mechanical pulverization in an inert atmosphere without any atmospheric exposure so as to manufacture powder having a maximum grain size of 90µm or less and reduced oxygen content. Thus, the Sb-Te alloy sputtering target structure can be uniformalized and refined, generation of cracks in the sintered target can be inhibited, and generation of arcing during sputtering can be inhibited. Further, surface ruggedness caused by sputter erosion can be reduced in order to obtain a high quality Sb-Te alloy sputtering target.
申请公布号 JP4615527(B2) 申请公布日期 2011.01.19
申请号 JP20060553829 申请日期 2005.11.29
申请人 发明人
分类号 C23C14/34;B22F9/04;B22F9/08;C22C1/04;C22C12/00 主分类号 C23C14/34
代理机构 代理人
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