| 摘要 |
PROBLEM TO BE SOLVED: To make miniaturization, thinning, and cost reduction of a solid-state image pickup device compatible with each other. SOLUTION: The solid-state imaging device is composed as follows. A wiring substrate 2 is a multilayer wiring board and has a translucent region 8 that guides a subject image formed by an optical equipment unit placed on a second surface to a solid-state image sensor 1. Each connection land part facing each pad electrode of the solid-state image sensor 1 is formed around the translucent region 8 on a first surface of the wiring substrate 2. The wiring substrate and the solid-state image sensor are electrically connected to each other via each bump electrode 3. The translucent region 8 is formed of an optical filter layer 2a constituting the wiring substrate 2. COPYRIGHT: (C)2008,JPO&INPIT
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