发明名称 HOT TOP INSULATING BOARD AND MANUFACTURING METHOD THEREOF
摘要 An inexpensive insulating plate with excellent bonding strength, moldability, and heat insulation properties is provided to stably manufacture an ingot having less solidification flaws in a steel ingot, and a dry manufacturing method of the insulating plate is provided. A hot top insulating plate comprises, by weight percent, 5 to 15% of Cenosphere, 0.0005 to 0.003% of a silane coupling agent, 0.1 to 0.4% of a non-polar solvent, 1 to 4% of a binder, 1 to 4% of a hardener, 0.001 to 0.08% of a hardening promoter, and the balance of silica, wherein: the Cenosphere has a hollowness of at least 90%; the silane coupling agent is one selected from aminopropylmethyldimethoxysilane, aminopropyltriethoxysilane, and aminopropyltrimethoxysilane; the non-polar solvent is kerosene or heavy oil; the binder includes organic solvent-soluble resins obtained by performing addition and condensation reactions of phenols and aldehydes, and modified resins and mixtures thereof; the hardener is a polyisocyanate compound; and the hardening promoter is 4-phenyl propyl pyridine.
申请公布号 KR100857477(B1) 申请公布日期 2008.09.08
申请号 KR20070032709 申请日期 2007.04.03
申请人 TAE KWANG INDUS., LTD. 发明人 HONG, DAE SIK
分类号 B22D7/10;B22D7/06;B22D7/12 主分类号 B22D7/10
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