发明名称 Epitaxial silicon wafer and fabrication method thereof
摘要 An epitaxial silicon wafer is provided in which an epitaxial layer is grown on a silicon wafer having a plane inclined from a {110} plane of a silicon single crystal as a main surface. In the silicon wafer for growing the epitaxial layer thereon, an inclination angle azimuth of the {110} plane is in the range of 0 to 45 degrees as measured from a <100> orientation parallel to the {110} plane toward a <110> direction. With such an arrangement, LPDs of 100 nm or less can be measured from a {110} wafer that has a carrier mobility (including the hole and electron mobilities) higher than that of a {100} wafer. Also, surface roughness degradation in the {110} wafer can be suppressed. Also, the surface state of the {110} wafer can be measured. Further, a quality evaluation can be performed on the {110} wafer.
申请公布号 EP1898450(A3) 申请公布日期 2011.01.19
申请号 EP20070017348 申请日期 2007.09.05
申请人 SUMCO CORPORATION 发明人 DOHI, TAKAYUKI;NAKAHARA, SHINJI;SAKURAI, MASAYA;SAKAI, MASATO
分类号 H01L21/20 主分类号 H01L21/20
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