发明名称 PROCESS FOR PRODUCING SI(1-V-W-X)CWALXNV BASE MATERIAL, PROCESS FOR PRODUCING EPITAXIAL WAFER, SI(1-V-W-X)CWALXNV BASE MATERIAL, AND EPITAXIAL WAFER& xA;
摘要 There are provided a Si (l-v-w-x) C w Al x N v substrate that achieves high crystallinity and low costs, an epitaxial wafer, and manufacturing methods thereof. A method for manufacturing a Si (l-v-w-x) C w Al x N v substrate according to the present invention includes the steps of preparing a different type of substrate 11 and growing a Si (l-v-w-x) C w Al x N v layer having a main surface on the different type of substrate 11. The component ratio x + v at the main surface of the Si (l-v-w-x) C w Al x N v layer is 0 < x + v < 1. The component ratio x + v increases or decreases monotonically from the interface between the Si (l-v-w-x) C w Al x N v layer and the different type of substrate 11 to the main surface of the Si (l-v-w-x) C w Al x N v layer. The component ratio x + v at the interface between the Si (l-v-w-x) C w Al x N v layer and the different type of substrate 11 is closer to that of the material of the different type of substrate 11 than the component ratio x + v at the main surface of the Si (l-v-w-x) C w Al x N v layer.
申请公布号 EP2276061(A1) 申请公布日期 2011.01.19
申请号 EP20090735517 申请日期 2009.04.17
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 SATOH, ISSEI;MIYANAGA, MICHIMASA;FUJIWARA, SHINSUKE;NAKAHATA, HIDEAKI
分类号 C30B29/38;C23C4/18;C23C14/06;C23C14/28;C23C16/34;C30B23/02;C30B23/08;C30B25/02;C30B29/36;C30B29/40;H01L21/02 主分类号 C30B29/38
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