发明名称
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device where delay time is short, and at the same time power consumption is small. SOLUTION: This semiconductor device has a conductive wire (30) provided on an insulating layer for covering a wiring layer formed on a semiconductor substrate. The conductive wire mutually connects a plurality of first electrodes (23) provided in the wiring layer to at least one second electrode (24) for external connection provided on the conductive wire, or mutually connects at least one first electrode provided in the wiring layer to a plurality of second electrodes for external connection.
申请公布号 JP4616985(B2) 申请公布日期 2011.01.19
申请号 JP20000363901 申请日期 2000.11.29
申请人 发明人
分类号 H01L23/12;H01L21/822;H01L25/065;H01L25/07;H01L25/18;H01L27/04;H01L27/10 主分类号 H01L23/12
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