发明名称 |
INTERCONNECT IN A MULTI-ELEMENT PACKAGE |
摘要 |
A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described. |
申请公布号 |
EP2195840(A4) |
申请公布日期 |
2011.01.19 |
申请号 |
EP20080781552 |
申请日期 |
2008.07.09 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
TANG, JINBANG;FREAR, DARREL R.;LYTLE, WILLIAM H. |
分类号 |
H01L25/04;H01L21/56;H01L23/00;H01L23/48 |
主分类号 |
H01L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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