COMPOSITION FOR FORMING POLYIMIDE/CLAY NANOCOMPOISTE AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

A composition for forming polyimide/clay nanocompoiste is provided to be used as a substrate material which is necessary for lightweight, thin, short, and small-sized packaging technology by realizing low-K dielectric, low thermal expansion and high thermal resistance property. A composition for forming polyimide/clay nanocompoiste comprises a polyamic acid of the chemical formula 1 which is introduced with a crosslinkable group at least one of both ends of a main chain; a layered clay compound; and organic solvent. In the chemical formula 1, A is represented by the following chemical formula 2; if n is 2 or greater, each A is the same or different, wherein Z1 and Z2 are the same or different and are univalent cross-linking functional group having a double bond; Y1 is divalent aliphatic or aromatic organic group; n is an integer of more than 1 and less than 1,000. In the chemical formula 2, X is tetravalent aliphatic or aromatic organic group; Y2 is divalent aliphatic or aromatic organic group; and Y1 and Y2 may be the same or different.