| 发明名称 |
EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN COMPOSITION VARNISH, PREPREG, METAL CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD |
| 摘要 |
<p>An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).</p> |
| 申请公布号 |
EP2070963(A4) |
申请公布日期 |
2011.01.19 |
| 申请号 |
EP20060797977 |
申请日期 |
2006.09.14 |
| 申请人 |
PANASONIC ELECTRIC WORKS CO., LTD |
发明人 |
TAMIYA, HIROKI;NAKAMURA, YOSHIHIKO;ARAKI, SHUNJI;IMAIZUMI, EIJI;FUJINO, KENTAROU;SAWADA, TOMOAKI;SHINPO, TAKASHI |
| 分类号 |
C08G59/20;B32B15/08;C08G59/30;C08G59/32;C08J5/24;C08L63/00;H05K1/03;H05K3/46 |
主分类号 |
C08G59/20 |
| 代理机构 |
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代理人 |
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